YS-2-001 适用于环氧树脂固化体系的潜伏性固化剂
Latent curing agent suitable for epoxy resin curing systems
YS-2-001 is a latent curing agent suitable for epoxy resin curing systems, designed specifically for single component systems. The difference between it and the current low-temperature latent curing agent is that the minimum curing temperature can reach 80 ℃. Its advantages are good product compatibility, easy solubility in epoxy resin, and convenient use. Its easy solubility in water allows it to be formulated and used with waterborne epoxy resins.
